SiCarrier Unveils Broad Array of Chip Equipment at SEMICON 2025, Challenging ASML’s Market Hold

China’s top chip equipment manufacturer, SiCarrier, has just introduced a comprehensive lineup of chip-making tools aimed at significantly enhancing the nation’s own semiconductor production capabilities.

Rising Competitor in the Chipmaking Arena

China’s strides in semiconductor development have gained momentum, largely due to the country’s determination to reduce reliance on global tech powerhouses. Pioneers such as Huawei and SMIC have been instrumental in establishing China’s own chip production framework. Yet, SiCarrier, often overlooked, is emerging as a key player in this narrative. Believed to have the backing of Huawei, SiCarrier specializes in crafting chip-making tools. At the recent SEMICON 2025 event in China, the company showcased its upcoming range of equipment, making it clear that they’re serious about advancing their position.

According to @zephyr_z9, who shared insights from SEMICON, SiCarrier has introduced an array of chip tools, among which are Rapid Thermal Processing (RTP) systems vital for creating IC devices. While the catalog highlights numerous innovations, it notably omits any mention of lithography tools—perhaps a strategic decision to keep specific developments under wraps. This move is a direct challenge to industry giants like ASML and Applied Materials. While these tools aim to strengthen the domestic market, their effectiveness is still being evaluated.

At SEMICON, Du Lijun, SiCarrier’s President, asserted that their tools are capable of manufacturing 5nm chips. However, the reliance on non-optical technology presents certain yield rate concerns, which could translate to higher production costs compared to international counterparts. Nonetheless, partnerships with SMIC and Huawei are already underway to overcome these hurdles. Given the strategic importance of semiconductor self-sufficiency to China, progress in this direction is anticipated.

Du Lijun remarked, "There might be a path where we can use non-optical technologies, that is, using our process equipment to solve some of the lithography issues," in a conversation with Reuters.

One of SiCarrier’s primary goals is to shift the semiconductor power dynamics away from countries like the Netherlands, a leader in chip-making technology. A prior report highlighted SiCarrier’s collaboration with Huawei and Shenzhen authorities to create custom EUV prototypes based on laser-induced discharge plasma (LDP). This marks China’s first step towards developing its own EUV lithography machines, potentially overcoming the final obstacle to achieving truly cutting-edge nodes.